---
title: "Nanoelectromechanical systems"
chunk: 3/4
source: "https://en.wikipedia.org/wiki/Nanoelectromechanical_systems"
category: "reference"
tags: "science, encyclopedia"
date_saved: "2026-05-05T03:55:36.112304+00:00"
instance: "kb-cron"
---

==== PDMS-coated piezoresistive nanoelectromechanical systems diaphragm ====
PDMS is frequently used within NEMS technology. For instance, PDMS coating on a diaphragm can be used for chloroform vapor detection.
Researchers from the National University of Singapore invented a polydimethylsiloxane (PDMS)-coated nanoelectromechanical system diaphragm embedded with silicon nanowires (SiNWs) to detect chloroform vapor at room temperature. In the presence of chloroform vapor, the PDMS film on the micro-diaphragm absorbs vapor molecules and consequently enlarges, leading to deformation of the micro-diaphragm. The SiNWs implanted within the micro-diaphragm are linked in a Wheatstone bridge, which translates the deformation into a quantitative output voltage. In addition, the micro-diaphragm sensor also demonstrates low-cost processing at low power consumption. It possesses great potential for scalability, ultra-compact footprint, and CMOS-IC process compatibility. By switching the vapor-absorption polymer layer, similar methods can be applied that should theoretically be able to detect other organic vapors.
In addition to its inherent properties discussed in the Materials section, PDMS can be used to absorb chloroform, whose effects are commonly associated with swelling and deformation of the micro-diaphragm; various organic vapors were also gauged in this study. With good aging stability and appropriate packaging, the degradation rate of PDMS in response to heat, light, and radiation can be slowed.

=== Biohybrid NEMS ===

The emerging field of bio-hybrid systems combines biological and synthetic structural elements for biomedical or robotic applications. The constituting elements of bio-nanoelectromechanical systems (BioNEMS) are of nanoscale size, for example DNA, proteins or nanostructured mechanical parts. Examples include the facile top-down nanostructuring of thiol-ene polymers to create cross-linked and mechanically robust nanostructures that are subsequently functionalized with proteins.

== Simulations ==
Computer simulations have long been important counterparts to experimental studies of NEMS devices.  Through continuum mechanics and molecular dynamics (MD), important behaviors of NEMS devices can be predicted via computational modeling before engaging in experiments.  Additionally, combining continuum and MD techniques enables engineers to efficiently analyze the stability of NEMS devices without resorting to ultra-fine meshes and time-intensive simulations. Simulations have other advantages as well: they do not require the time and expertise associated with fabricating NEMS devices; they can effectively predict the interrelated roles of various electromechanical effects; and parametric studies can be conducted fairly readily as compared with experimental approaches.  For example, computational studies have predicted the charge distributions and "pull-in" electromechanical responses of NEMS devices.  Using simulations to predict mechanical and electrical behavior of these devices can help optimize NEMS device design parameters.

== Reliability and Life Cycle of NEMS ==

=== Reliability and Challenges ===
Reliability provides a quantitative measure of the component's integrity and performance without failure for a specified product lifetime. Failure of NEMS devices can be attributed to a variety of sources, such as mechanical, electrical, chemical, and thermal factors. Identifying failure mechanisms, improving yield, scarcity of information, and reproducibility issues have been identified as major challenges to achieving higher levels of reliability for NEMS devices. Such challenges arise during both manufacturing stages (i.e. wafer processing, packaging, final assembly) and post-manufacturing stages (i.e. transportation, logistics, usage).

==== Packaging ====
Packaging challenges often account for 75–95% of the overall costs of MEMS and NEMS. Factors of wafer dicing, device thickness, sequence of final release, thermal expansion, mechanical stress isolation, power and heat dissipation, creep minimization, media isolation, and protective coatings are considered by packaging design to align with the design of the MEMS or NEMS component. Delamination analysis, motion analysis, and life-time testing have been used to assess wafer-level encapsulation techniques, such as cap to wafer, wafer to wafer, and thin film encapsulation. Wafer-level encapsulation techniques can lead to improved reliability and increased yield for both micro and nanodevices.

==== Manufacturing ====
Assessing the reliability of NEMS in early stages of the manufacturing process is essential for yield improvement. Forms of surface forces, such as adhesion and electrostatic forces, are largely dependent on surface topography and contact geometry. Selective manufacturing of nano-textured surfaces reduces contact area, improving both adhesion and friction performance for NEMS. Furthermore, the implementation of nanopost to engineered surfaces increase hydrophobicity, leading to a reduction in both adhesion and friction.
Adhesion and friction can also be manipulated by nanopatterning to adjust surface roughness for the appropriate applications of the NEMS device. Researchers from Ohio State University used atomic/friction force microscopy (AFM/FFM) to examine the effects of nanopatterning on hydrophobicity, adhesion, and friction for hydrophilic polymers with two types of patterned asperities (low aspect ratio and high aspect ratio). Roughness on hydrophilic surfaces versus hydrophobic surfaces are found to have inversely correlated and directly correlated relationships respectively.
Due to its large surface area to volume ratio and sensitivity, adhesion and friction can impede performance and reliability of NEMS devices. These tribological issues arise from natural down-scaling of these tools; however, the system can be optimized through the manipulation of the structural material, surface films, and lubricant. In comparison to undoped Si or polysilicon films, SiC films possess the lowest frictional output, resulting in increased scratch resistance and enhanced functionality at high temperatures. Hard diamond-like carbon (DLC) coatings exhibit low friction, high hardness and wear resistance, in addition to chemical and electrical resistances. Roughness, a factor that reduces wetting and increases hydrophobicity, can be optimized by increasing the contact angle to reduce wetting and allow for low adhesion and interaction of the device to its environment.
Material properties are size-dependent. Therefore, analyzing the unique characteristics on NEMS and nano-scale material becomes increasingly important to retaining reliability and long-term stability of NEMS devices. Some mechanical properties, such as hardness, elastic modulus, and bend tests, for nano-materials are determined by using a nano indenter on a material that has undergone fabrication processes. These measurements, however, do not consider how the device will operate in industry under prolonged or cyclic stresses and strains. The theta structure is a NEMS model that exhibits unique mechanical properties. Composed of Si, the structure has high strength and is able to concentrate stresses at the nanoscale to measure certain mechanical properties of materials.